Ceramic MCM / LTCC Technology
Supports designs for all types of MCM
technologies. A dedicated hybrid library
allows a user to save bare die and dies
with wires.
RF / Microwave Technology
Provides tools that enhances
the design of RF / Microwave
/ Wireless printed circuit
boards and creation
of
complex embedded circuits.
PCB Technology
The PCB layout environment
is a
core set of tools to
natively supports
all major
features for PCB circuit
design technologies.
Flex Technology
Provides tools to speed up the
design of
flexible printed circuits
with true arcs teardrop
fillets
with in DRC and Gerber files.
Lead Frame Technology
Semi-automatic, yet extremely fast
process to turn Lead Frame designs that
were manually drawn to the standard CDS
data format.
IC Packaging Technology
Contains powerful tools that have
been
developed in direct response
to the
needs of the world’s largest silicon and
packaging companies.
Flip Chip / Die Bump Technology
Automates the process of creating
redistribution routing and bump
artwork
to convert a standard
die to a flipchip
die.
Schematic Layout Design
A full featured schematic program
capable of quickly laying out schematic
diagrams and outputting netlists to most
popular formats.
